Dutch semiconductor equipment giant ASML is expanding into next-generation hybrid bonding, a technique that creates dense electrical connections by directly…
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China’s JCET to build new plant in Shanghai to expand advanced chip packaging
Chinese chip-packaging and testing giant Jiangsu Changjiang Electronics Technology (JCET) says it will invest 7.8 billion yuan (US$1.15 billion) to…
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Semicon China: AI, advanced packaging set to drive country’s chip industry growth
Agentic artificial intelligence and advanced packaging technology will be key growth drivers for China’s chip industry in coming years, as…
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